2026 3rd Recruitment for Beneficiary Companies of the Semiconductor Advanced Packaging Demonstration Center Construction Project
Companies outside Jeonnam-Gwangju Metropolitan City can participate by submitting a relocation plan, offering an opportunity to leverage regional infrastructure.
- Eligible
- Domestic companies in the semiconductor packaging industry
- Deadline
- 2026.10.30
Applications for performance/reliability evaluation and exhibition participation must be submitted via email by noon on October 30, 2026 (Fri), while technical consulting applications are due by noon on October 8, 2026 (Thu). Eligible applicants are domestic companies in the semiconductor packaging industry; those outside Jeonnam-Gwangju Metropolitan City must submit a relocation plan upon signing the agreement and complete the move within the contract period.
3-second summary
- Target: Domestic companies in the semiconductor packaging industry
- Deadline (Evaluation/Exhibition): Oct 30, 2026 (Fri) 12:00
- Deadline (Technical Consulting): Oct 8, 2026 (Thu) 12:00
- Application Method: Email submission only
Eligibility checklist
- Companies operating in the semiconductor packaging industry and related upstream/downstream products/technologies
- Companies outside Jeonnam-Gwangju Metropolitan City: Must submit a relocation plan upon agreement signing and complete relocation to Jeonnam-Gwangju Metropolitan City within the contract period
Schedule & how to apply
- Deadline (Performance/Reliability Evaluation, Exhibition Participation): Oct 30, 2026 (Fri) 12:00
- Deadline (Technical Consulting): Oct 8, 2026 (Thu) 12:00
- Application Method: Email submission only
Recommended for
- Recommended for CEOs of companies holding technology or operating businesses related to semiconductor packaging.
- Suitable for CEOs willing to relocate their business premises to Jeonnam-Gwangju Metropolitan City.
Frequently asked questions
Who is eligible to apply?
This program is for Domestic companies in the semiconductor packaging industry. Details: Companies operating in the semiconductor packaging industry and related upstream/downstream products/technologies; Companies outside Jeonnam-Gwangju Metropolitan City: Must submit a relocation plan upon agreement signing and complete relocation to Jeonnam-Gwangju Metropolitan City within the contract period.
When is the application deadline?
The application deadline is 2026.10.30. Schedules may change — confirm against the official program notice.
How do I apply?
Applications follow the official program notice, which is in Korean. See the source link for the method and receiving office; Beaconoi can prepare an English draft for your review.
Last updated · Source: official program notice
※ Program information is compiled from each institution’s public sources; actual eligibility, amounts and deadlines may change. Always verify against the official notice (in Korean) before applying.