2026 AI & Smart Electronics Mold Support Program for Companies
Companies with completed smart electronics designs can receive up to KRW 16.5 million in mold manufacturing support per product.
- Deadline
- Closed
Support runs from the start date until the end of December 2026, with engineers at Seoul Yongshan Product Factory providing mold technology support and fabrication. It targets companies with completed designs for electronic boards, mechanical parts, and housings, offering up to KRW 16.5 million per product for mold manufacturing.
3-second summary
- Support Period: From start date until end of December 2026
- Support Content: Mold design (2D, 3D) and fabrication assistance
- Support Scale: Up to 6 products selected, max KRW 16.5 million equivalent per product
- Eligibility: Companies with completed designs for electronic boards, mechanical parts, and housings
Recommended for
- Recommended for CEOs of smart electronics companies who have completed the design phase for electronic boards, mechanical parts, or housings.
Frequently asked questions
How do I apply?
Applications follow the official program notice, which is in Korean. See the source link for the method and receiving office; Beaconoi can prepare an English draft for your review.
Last updated · Source: official program notice
※ Program information is compiled from each institution’s public sources; actual eligibility, amounts and deadlines may change. Always verify against the official notice (in Korean) before applying.